Skyworks Enables High-Power Switching For Wireless Infrastructure

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As IoT (Internet of Things) and data-intensive multimedia applications have been on rise from quite some time. Similarly, cellular infrastructures are becoming more and more strengthened to meet the rapidly expanding demand for network. Specially designed for the TDD 4G/3G/2G macro and micro-cell base stations, this advanced family of high-power SPDT switches embedded with integrated drivers. These switches are capable of delivering market leading efficiency and performance in a very small package finally delivering much higher data rates for very low power consumption. 
   

Fig. 1: SKY12241-492LF

Fig. 2: SKY12242-492LF

Fig. 3: SKY12245-492LF


There are mainly three product worth noticing, the SKY12241-492LF, SKY12242-492LF and SKY12245-492LF. Let’s see these products a little closely. 
●    SKY12241-492LF: It is an integrated, high-power SPDT (Single-Pole, Double-Throw) switch with a driver circuit meant for TD-LTE applications. This part works with a single +5V supply and switches with single control voltage. The device features lower RX and TX insertion loss, higher isolation along with much lower DC power consumption and needs minimal outer components allow a smaller PCCB footprint. You can avail this device in 5 x 5mm, 20-pin QFN (Quad Flat No-Lead) package. 
●    SKY12242-492LF:  It is an integrated and compact high-power SPDT (Single-Pole, Double-Throw) switch meant for TD-LTE applications. This one works with a single +5 V supply, it switches with a 0-3 V single control voltage. The device comes embedded with RX and TX insertion loss with lower DC power consumption and needs least external components leading to smaller PCB footprint. 
●    SKY12245-492LF: This one has the same configurations as the other two. The only difference is that this one can be tuned up to special RF bands that fall in the range of 0.3 - 3.8 GHz through modification of selected outer SMT components. It also features TX and RX insertion loss, higher isolation along with lower DC power consumption and has a much smaller PCB footprint because of its small sized outer components.